On thermal interface materials with polydisperse fillers: Packing algorithm and effective properties
- Piyas Chowdhury
- Anuja De Silva
- et al.
- 2018
- InterPACK 2018
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14 results for Kamal Sikka
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
BEOL thermal characterization for 3-D packaging
- J. Wakil
- E.G. Colgan
- et al.
- 2008
- IMAPS 2008
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
- L. Valdevit
- V.D. Khanna
- et al.
- 2008
- Microelectronics Reliability