Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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14 results for Kamal Sikka

Optimal filler sizes for thermal interface materials
- - Piyas Chowdhury
  - Kamal Sikka
  - et al.
- 2019
- ITherm 2019
On thermal interface materials with polydisperse fillers: Packing algorithm and effective properties
- - Piyas Chowdhury
  - Anuja De Silva
  - et al.
- 2018
- InterPACK 2018
BEOL thermal characterization for 3-D packaging
- - J. Wakil
  - E.G. Colgan
  - et al.
- 2008
- IMAPS 2008
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
- - L. Valdevit
  - V.D. Khanna
  - et al.
- 2008
- Microelectronics Reliability