High performance FDSOI CMOS technology with metal gate and high-k
- Bruce Doris
- Y.-H. Kim
- et al.
- 2005
- VLSI Technology 2005
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29 results for Anna Topol
Assembly technology for three dimensional integrated circuits
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- VMIC 2005
Enabling SOI-based assembly technology for three-dimensional (3D) integrated circuits (ICs)
- A. Topol
- D.C. La Tulipe
- et al.
- 2005
- IEDM 2005
Stable SRAM cell design for the 32 nm node and beyond
- Leland Chang
- David M. Fried
- et al.
- 2005
- VLSI Technology 2005
Looking into the crystal ball: Future device learning using hybrid E-beam and optical lithography
- S.E. Steen
- S.J. McNab
- et al.
- 2005
- Microlithography 2005
Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures
- Anna W. Topol
- Bruce K. Furman
- et al.
- 2004
- ECTC 2004
Aggressively scaled (0.143 μm 2) 6T-SRAM cell for the 32 nm node and beyond
- D. Fried
- J. Hergenrother
- et al.
- 2004
- IEDM 2004
Chemical vapor deposition of ZnS:Mn for thin-film electroluminescent display applications
- Anna W. Topol
- Kathleen A. Dunn
- et al.
- 2004
- Journal of Materials Research
Electrical integrity of state-of-the-art 0.13 μm SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
- K.W. Guarini
- A. Topol
- et al.
- 2002
- IEDM 2002