Publications

2 results for Mike Lofaro

Fully Encapsulated Fine Pitch Dual Damascene Organic RDL with Low Dk Df Photosensitive Polyimide and Its Reliability
- - Minhua Lu
  - Joyce Liu
  - et al.
- 2025
- ECTC 2025
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- - Daniel Edelstein
  - Son Nguyen
  - et al.
- 2024
- IEDM 2024