Publications

3 results for L.W. Wangoh

Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- - S. Nguyen
  - H. Huang
  - et al.
- 2025
- VLSI Technology and Circuits 2025
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- - D. Edelstein
  - A. Jog
  - et al.
- 2025
- IITC 2025
Evaluation of Cu surface diffusion on different metal liner materials for Cu reflow applications
- - O. van der Straten
  - L.W. Wangoh
- 2024
- Journal of Materials Research