Publications

64 results for Andrew Simon

An optimal liner for copper damascene interconnects
- - D. Edelstein
  - C. Uzoh
  - et al.
- 2001
- ADMETA 2001
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- - R.D. Goldblatt
  - B.N. Agarwala
  - et al.
- 2000
- IITC 2000
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- - J. Heidenreich
  - D. Edelstein
  - et al.
- 1998
- IITC 1998
Full copper wiring in a sub-0.25 μm CMOS ULSI technology
- - D. Edelstein
  - J. Heidenreich
  - et al.
- 1997
- IEDM 1997