Publications

2 results for Theodorian Borca-tasciuc

A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- - Max Bloomfield
  - Amogh Wasti
  - et al.
- 2025
- ITherm 2025
Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- - Amogh Wasti
  - Zongmin Yang
  - et al.
- 2025
- ITherm 2025