Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- S. Nguyen
- H. Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Publications
3 results for K. Choi
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- D. Edelstein
- A. Jog
- et al.
- 2025
- IITC 2025
First Demonstration of 16nm Pitch Subtractive Ru Interconnects for Advanced Technology Nodes
- C. Penny
- K. Motoyama
- et al.
- 2025
- IITC 2025