Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- Sayuri Kohara
- Toyohiro Aoki
- et al.
- 2022
- ITherm 2022
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32 results for Toyohiro Aoki
Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
- Takashi Hisada
- Sayuri Kohara
- et al.
- 2022
- ICEP 2022
Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology
- Toyohiro Aoki
- Katsuhiro Yoshida
- et al.
- 2021
- ICEP 2021
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2021
- ICEP 2021
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Circuits 2017
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Technology 2017
Flip chip joining with low temperature solders and thermal gradient bonding
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2017
- ICEP 2017
Effects of solder wettability of resist materials on solder filling with Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ICEP 2016
Advanced interconnect technologies in the era of cognitive computing
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2016
- Pan Pacific 2016
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
- Kuniaki Sueoka
- Akihiro Horibe
- et al.
- 2015
- 3DIC 2015