Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

31 results for Sayuri Kohara

Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- - Keishi Okamoto
  - Sayuri Kohara
  - et al.
- 2015
- ICEP-IAAC 2015
Fine-pitch solder joining for high density interconnection
- - Kuniaki Sueoka
  - Sayuri Kohara
  - et al.
- 2014
- ICEP 2014
Thermo-mechanical evaluation of 3D packages
- - Sayuri Kohara
  - Akihiro Horibe
  - et al.
- 2013
- 3DIC 2013
Scaling challenges of semiconductor packaging in the era of big data
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2013
- IMAPS 2013
Scaling challenges of packaging in the Era of Big Data
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2013
- VLSI Technology 2013
Effect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2012
- IMAPS 2012
Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2012
- ICSJ 2012
Microstructure observation of electromigration behavior in peripheral C2 flip chip interconnection with solder capped Cu pillar bump
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2011
- IMAPS 2011
Effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2011
- IMPACT 2011
High channel count connector for optical interconnect
- - Yoichi Taira
  - Fumiaki Yamada
  - et al.
- 2008
- OF&T 2008