Publications

2 results for A. Jog

Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- - S. Nguyen
  - H. Huang
  - et al.
- 2025
- VLSI Technology and Circuits 2025
Innovations Enabling the Continued Extendibility of Cu and Post-Cu Damascene BEOL Technologies
- - D. Edelstein
  - A. Jog
  - et al.
- 2025
- IITC 2025