Chip-to-Package Interaction for a 90 nm Cu / PECVD Low-k technology
- W. Landers
- D. Edelstein
- et al.
- 2004
- IITC 2004
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143 results for Daniel Edelstein
90 nm SiCOH technology in 300 mm manufacturing
- L. Clevenger
- M. Yoon
- et al.
- 2004
- ADMETA 2004
Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Moisture and oxygen uptake in Low K/ copper interconnect structures
- T.M. Shaw
- D. Jimerson
- et al.
- 2003
- ADMETA 2003
An optimal liner for copper damascene interconnects
- D. Edelstein
- C. Uzoh
- et al.
- 2001
- ADMETA 2001
SiCOH dielectrics: From low-κ to Ultralow-κ by PECVD
- A. Grill
- D. Edelstein
- et al.
- 2001
- ADMETA 2001
On-chip wiring design challenges for gigahertz operation operation
- Alina Deutsch
- Paul W. Coteus
- et al.
- 2001
- Proceedings of the IEEE