Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects
- Nicholas A. Lanzillo
- Lawrence Clevenger
- et al.
- 2020
- Journal of Applied Physics
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143 results for Daniel Edelstein
Sequential Lateral Solidification of Silicon Thin Films on Cu BEOL-Integrated Wafers for Monolithic 3-D Integration
- Fabio Carta
- Stephen M. Gates
- et al.
- 2015
- IEEE T-ED
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- James Kelly
- X. Lin
- et al.
- 2013
- JES
Mechanism of co liner as enhancement layer for Cu interconnect gap-fill
- M. He
- X. Zhang
- et al.
- 2013
- JES
Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2013
- Microelectronic Engineering
Invasion percolation model for abnormal time-dependent dielectric breakdown characteristic of low-k dielectrics due to massive metallic diffusion
- Fen Chen
- Michael Shinosky
- et al.
- 2012
- Applied Physics Letters
Electromigration in Cu(Al) and Cu(Mn) damascene lines
- C.-K. Hu
- J. Ohm
- et al.
- 2012
- Journal of Applied Physics
Co capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2012
- Microelectronic Engineering
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
Stress control during thermal annealing of copper interconnects
- C.-C. Yang
- Christian Witt
- et al.
- 2011
- Applied Physics Letters