High performance dielectrics and processes for ULSI interconnection technologies
- J. Paraszczak
- D. Edelstein
- et al.
- 1993
- IEDM 1993
Publications
Date
Featured collections
Popular topics
143 results for Daniel Edelstein
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Line Resistance Reduction in Advanced Copper Interconnects
- Chih-Chao Yang
- T. Standaert
- et al.
- 2017
- IEEE Electron Device Letters
Via resistance reduction in advanced copper interconnects
- Chih-Chao Yang
- Terry A. Spooner
- et al.
- 2017
- IEEE Electron Device Letters
Microstructure modulation in copper interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IEEE Electron Device Letters
Effects of metal capping on thermal annealing of copper interconnects
- Chih-Chao Yang
- B. Li
- et al.
- 2012
- IEEE Electron Device Letters
In situ Co/SiC(N,H) capping layers for Cu/Low-k interconnects
- Chih-Chao Yang
- B. Li
- et al.
- 2012
- IEEE Electron Device Letters
Characterization of Cu reflows on Ru
- C.-C. Yang
- P. Flaitz
- et al.
- 2011
- IEEE Electron Device Letters
Low-temperature reflow anneals of Cu on Ru
- C.-C. Yang
- Fenton R. McFeely
- et al.
- 2011
- IEEE Electron Device Letters
Characterization of copper electromigration dependence on selective chemical vapor deposited cobalt capping layer thickness
- C.-C. Yang
- F. Baumann
- et al.
- 2011
- IEEE Electron Device Letters