Evaluation of the chemical-mechanical planarization (CMP) performance of silicon nitride and silicon carbide as hard mask materials for Cu-based interconnect technology
- Wei-Tsu Tseng
- Jia Lee
- et al.
- 2002
- MRS Spring Meeting 2002
Publications
32 results for Wei-Tsu Tseng
An acid-based electroless Cu deposition process: Chemical formulation, film characteristics and CMP performance
- Wei-Tsu Tseng
- Chia-Hsien Lo
- et al.
- 2000
- ECS Meeting 2000