Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
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4 results for Vinay Pai
Process trace analytics for process development
- Robert J. Baseman
- Fateh A. Tipu
- et al.
- 2021
- SPIE Advanced Lithography 2021
Simulation of 3D Doping by Plasma Immersion Ion Implantation for FinFET or deep Trench Doping Applications. Effect of main Process Parameters and Study of Wall Doping Non-Uniformity as Function of Form Factor and Device Scaling
- Frank Torregrosa
- Benjamin Roux
- et al.
- 2018
- IIT 2018
Particle reduction in back end of line plasma-etching process: CFM: Contamination free manufacturing
- Lijuan Zou
- Alex Vaghese
- et al.
- 2018
- ASMC 2018