Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

7 results for Hermann Oppermann

Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
- - Thomas Brunschwiler
  - Gerd Schlottig
  - et al.
- 2017
- IEDM 2017
Microfluidic Interposer for High Performance Fluidic Chip Cooling
- - Wolfram Steller
  - Frank Windrich
  - et al.
- 2018
- ESTC 2018
Dual-Side Heat Removal by Silicon Cold Plate and Interposer with Embedded Fluid Channels
- - Thomas Brunschwiler
  - Wolfram Steller
  - et al.
- 2018
- ITherm 2018
Intra-stack sealing of tier interconnects using the interconnect alloy
- - Jessica Kleff
  - Gerd Schlottig
  - et al.
- 2016
- ESTC 2016
Forced convective interlayer cooling in vertically integrated packages
- - Thomas Brunschwiler
  - Bruno Michel
  - et al.
- 2008
- ITherm 2008
Co-package technology platform for low-power and low-cost data centers
- - Konstantinos Papatryfonos
  - David R. Selviah
  - et al.
- 2021
- Applied Sciences
Interlayer cooling potential in vertically integrated packages
- - T. Brunschwiler
  - Bruno Michel
  - et al.
- 2008
- Microsystem Technologies