A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- Ruilong Xie
- Pietro Montanini
- et al.
- 2016
- IEDM 2016
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17 results for Spyridon Skordas
Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Copper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
Sub-20 nm abrupt USJ formation with long ms-flash with sub-2 nm dopant motion control
- Kam-Leung Lee
- Isaac Lauer
- et al.
- 2010
- IWJT 2010
Electrical properties of ultrathin Al2O3 films grown by metalorganic chemical vapor deposition for advanced complementary metal-oxide semiconductor gate dielectric applications
- Spyridon Skordas
- Filippos Papadatos
- et al.
- 2005
- Journal of Materials Research
Rinse additives for defect suppression in 193 nm and 248 nm lithography
- Spyridon Skordas
- Ryan L. Burns
- et al.
- 2004
- Microlithography 2004
Low temperature metal organic chemical vapor deposition of aluminum oxide thin films for advanced CMOS gate dielectric applications
- Spyridon Skordas
- Filippos Papadatos
- et al.
- 2002
- MRS Proceedings 2002