Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2010
- ECTC 2010
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61 results for Cornelia Tsang
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- Bing Dang
- Paul Andry
- et al.
- 2010
- ECTC 2010
24-channel optical transceiver module for waveguide-on-card interconnects
- Jeffrey A. Kash
- Clint L. Schow
- et al.
- 2010
- OFC/NFOEC 2010
24-Channel optical transceiver module for waveguide-on-card interconnects
- Jeffrey A. Kash
- Clint L. Schow
- et al.
- 2010
- OFC 2010
Die-to-wafer 3D integration technology for high yield and throughput
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- MRS Fall Meeting 2008
Reliable through silicon vias for 3D silicon applications
- M.J. Shapiro
- M. Interrante
- et al.
- 2009
- IITC 2009
Terabus: Chip-to-chip board-level optical data buses
- J.A. Kash
- F.E. Doany
- et al.
- 2008
- LEOS 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008