3-D silicon integration and silicon packaging technology using silicon through-vias
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2006
- IEEE Journal of Solid-State Circuits
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61 results for Cornelia Tsang
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
Chip-to-chip optical interconnects
- J.A. Kash
- F.E. Doany
- et al.
- 2006
- OFC/NFOEC 2006
Characterization of flip chip microjoins up to 40 GHz using silicon carrier
- Chirag S. Patel
- Paul S. Andry
- et al.
- 2005
- IITC 2005
Terabus: A chip-to-chip parallel optical interconnect
- J.A. Kash
- F.E. Doany
- et al.
- 2005
- LEOS 2005
Terabus: A Waveguide-Based Parallel Optical Interconnect
- F.E. Doany
- J.A. Kash
- et al.
- 2005
- FiO 2005
"Terabus" - A waveguide-based parallel optical interconnect for Tb/s-class on-board data transfers in computer systems
- L. Schares
- C.L. Schow
- et al.
- 2005
- ECOC 2005
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ECTC 2005
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2005
- CICC 2005
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev