A 10Gb/s 5-tap-DFE/4-tap-FFE transceiver in 90nm CMOS
- M. Meghelli
- S. Rylov
- et al.
- 2006
- ISSCC 2006
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43 results for Lei Shan
Thermal-mechanical analysis of terabus high-speed optoelectronic package
- Shashikant Hegde
- Lei Shan
- et al.
- 2005
- ECTC 2005
Thermal impedance measurements of junction-down mounted single-side contact laser diodes
- Guy Cohen
- Lei Shan
- et al.
- 2004
- ECTC 2004
120 Gb/s VCSEL-based parallel optical link and custom 120 Gb/s testing station
- Daniel Kuchta
- Young Kwark
- et al.
- 2004
- ECTC 2004
Model-to-hardware correlations in the design of a 50Gb/s package
- Lei Shan
- Mounir Meghelli
- et al.
- 2003
- ECTC 2003
A method of multi-node thermal network extraction for SPICE compatible simulations
- Lei Shan
- Daniel Kuchta
- et al.
- 2003
- ECTC 2003
50 Gb/s SiGe BiCMOS 4:1 multiplexer and 1:4 demultiplexer for serial communication systems
- Mounir Meghelli
- Alexander V. Rylyakov
- et al.
- 2002
- ISSCC 2002
50 Gb/s SiGe BiCMOS 4:1 multiplexer and 1:4 demultiplexer for serial-communication systems
- Mounir Meghelli
- Alexander V. Rylyakov
- et al.
- 2002
- ISSCC 2002
A 1.4 pJ/bit, Power-Scalable 16×12 Gb/s Source-Synchronous I/O With DFE Receiver in 32 nm SOI CMOS Technology
- Timothy O. Dickson
- Yong Liu
- et al.
- 2015
- IEEE JSSC
High performance packaging laminates enable buses for exascale systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- DesignCon 2015