Analysis of TSV geometric parameter impact on switching noise in 3D power distribution network
- Huanyu He
- James J.-Q. Lu
- et al.
- 2014
- ASMC 2014
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93 results for Xiaoxiong Gu
Experimental validation of an 8 GHz EBG based common mode filter and impact of manufacturing uncertainties
- Francesco De Paulis
- Muhammet Hilmi Nisanci
- et al.
- 2013
- EMC 2013
Mitigation of TSV-substrate noise coupling in 3-D CMOS SOI technology
- Xiaoxiong Gu
- Keith Jenkins
- 2013
- EPEPS 2013
Signal and power integrity (SPI) co-analysis for high-speed communication channels
- Renato Rimolo-Donadio
- Xiaomin Duan
- et al.
- 2013
- DesignCon 2013
Terabit/s packaging design for testing of high-speed IC transceivers
- Christian Baks
- Renato Rimolo-Donadio
- et al.
- 2013
- DesignCon 2013
Design and experimental validation of compact common mode filter based on EBG technology
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- DesignCon 2013
A fully-integrated dual-polarization 16-element W-band phased-array transceiver in SiGe BiCMOS
- Alberto Valdes-Garcia
- Arun Natarajan
- et al.
- 2013
- RFIC 2013
TSV density impact on 3D power delivery with high aspect ratio TSVs
- Huanyu He
- James J.-Q. Lu
- et al.
- 2013
- ASMC 2013
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above
- Xiaoxiong Gu
- Young H. Kwark
- et al.
- 2012
- DesignCon 2012
Electrical interconnect design for testing of high-speed IC transceivers
- Renato Rimolo-Donadio
- Christian Baks
- et al.
- 2012
- EPEPS 2012