Mitigation of TSV-substrate noise coupling in 3-D CMOS SOI technology
- Xiaoxiong Gu
- Keith Jenkins
- 2013
- EPEPS 2013
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93 results for Xiaoxiong Gu
Terabit/s packaging design for testing of high-speed IC transceivers
- Christian Baks
- Renato Rimolo-Donadio
- et al.
- 2013
- DesignCon 2013
Signal and power integrity (SPI) co-analysis for high-speed communication channels
- Renato Rimolo-Donadio
- Xiaomin Duan
- et al.
- 2013
- DesignCon 2013
Design and experimental validation of compact common mode filter based on EBG technology
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- DesignCon 2013
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
Power delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
A fully-integrated dual-polarization 16-element W-band phased-array transceiver in SiGe BiCMOS
- Alberto Valdes-Garcia
- Arun Natarajan
- et al.
- 2013
- RFIC 2013
Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications
- Xiaoxiong Gu
- Dong Gun Kam
- et al.
- 2013
- ECTC 2013
TSV density impact on 3D power delivery with high aspect ratio TSVs
- Huanyu He
- James J.-Q. Lu
- et al.
- 2013
- ASMC 2013
A 90nm CMOS integrated Nano-Photonics technology for 25Gbps WDM optical communications applications
- Solomon Assefa
- Steven Shank
- et al.
- 2012
- IEDM 2012