Fast physics-based via and trace models for signal and power integrity co-analysis
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2010
- DesignCon 2010
Publications
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93 results for Xiaoxiong Gu
Random rough surface effects on wave propagation in interconnects
- Leung Tsang
- Henning Braunisch
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Electrical and physical parametric study of high-speed link performance
- Ki Jin Han
- Mark B. Ritter
- et al.
- 2010
- EPEPS 2010
Efficient full-wave modeling of high density TSVs for 3D integration
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2010
- ECTC 2010
Electrical characterization of 3D Through-Silicon-Vias
- Fei Liu
- Xiaoxiong Gu
- et al.
- 2010
- ECTC 2010
Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- Alina Deutsch
- Roger S. Krabbenhoft
- et al.
- 2010
- IEEE Trans Electromagn Compat
On adding metalization to improve via performance on PCBs
- Albert E. Ruehli
- Xiaoxiong Gu
- et al.
- 2009
- EPEPS 2009
Fast full wave analysis of PCB via arrays with model-to-hardware correlation
- Xiaoxiong Gu
- Boping Wu
- et al.
- 2009
- EPEPS 2009
Model-to-hardware correlation of disk resonators for via-array modeling in high-speed PCBs
- Arun Reddy Chada
- Young H. Kwark
- et al.
- 2009
- EPEPS 2009
Fully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects
- Xiaoxiong Gu
- Francesco De Paulis
- et al.
- 2009
- DesignCon 2009