Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- Jonas Zürcher
- Xi Chen
- et al.
- 2015
- NANO 2015
Publications
Date
Featured collections
Popular topics
3 results for Guo Hong
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- Rahel Straessle
- Severin Zimmermann
- et al.
- 2018
- IEEE Transactions on CPMT
In situ assembly in confined spaces of coated particle scaffolds as thermal underfills with extraordinary thermal conductivity
- Guo Hong
- Thomas M. Schutzius
- et al.
- 2014
- ACS AMI