Effect of additives on shape evolution during electrodeposition
- Effendi Rusli
- Feng Xue
- et al.
- 2007
- JES
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29 results for Hariklia Deligianni
Anisotropic growth of nanostructures in germanium electroplating
- Q. Huang
- H. Deligianni
- et al.
- 2007
- Electrochemical and Solid-State Letters
Single-crystalline Germanium thin films by electrodeposition and solid-phase epitaxy
- Q. Huang
- S.W. Bedell
- et al.
- 2007
- Electrochemical and Solid-State Letters
Electrodeposition of Cu on Ta-based layer II: Cu Electrodeposition on Cu/Ta bilayers
- J. Kelly
- M. Zheng
- et al.
- 2007
- JES
Electrodeposition of Cu on Ta-based layers: I. Electrodeposition on Ta
- M. Zheng
- J. Kelly
- et al.
- 2007
- JES
An alternative low resistance MOL technology with electroplated rhodium as contact plugs for 32nm CMOS and beyond
- I. Shao
- J.M. Cotte
- et al.
- 2007
- IITC 2007
Gold electrodeposition on silicon
- Q. Huang
- H. Deligianni
- et al.
- 2006
- ECS Meeting 2006
Electrodeposition of gold on silicon nucleation and growth phenomena
- Q. Huang
- H. Deligianni
- et al.
- 2006
- JES
Role of oxygen vacancies in VFB/Vt stability of pFET metals on HfO2
- E. Cartier
- F.R. McFeely
- et al.
- 2005
- VLSI Technology 2005
Numerical simulation of electrochemical planarization of copper overburden
- Alan C. West
- Ingrid Shao
- et al.
- 2005
- JES