The chemistry of additives in damascene copper plating
- Philippe M. Vereecken
- Robert A. Binstead
- et al.
- 2005
- IBM J. Res. Dev
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29 results for Hariklia Deligianni
Electrochemical planarization of interconnect metallization
- Alan C. West
- Hariklia Deligianni
- et al.
- 2005
- IBM J. Res. Dev
Uniform copper electroplating on resistive substrates
- Rui Fang
- Keisuke Namiki
- et al.
- 2004
- ECS Meeting 2004
Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods
- C.V. Jahnes
- J.M. Cotte
- et al.
- 2004
- MEMS 2004
Effect of benzotriazole on the anisotropic electrolytic etching of copper
- Demetrius Papapanoyiotou
- Hariklia Deligianni
- et al.
- 1998
- JES
Damascene copper electroplating for chip interconnections
- P.C. Andricacos
- C. Uzoh
- et al.
- 1998
- IBM J. Res. Dev
Effect of near-surface pH on electrodeposition of iron and permalloy
- H. Deligianni
- L. Romankiw
- 1989
- ECS Meeting 1989
Effect of near-surface pH on electrodeposition of nickel on a rotating fine mesh electrode
- H. Deligianni
- L. Romankiw
- 1990
- AESF Annual Technical Conference 1990
Effect of near-surface pH on electrodeposition of nickel
- H. Deligianni
- L. Romankiw
- 1989
- ECS Meeting 1989