Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.