Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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26 results for Shyng-Tsong Chen

Multi-level integration of patternable low-κ material into advanced Cu BEOL
- - Qinghuang Lin
  - Shyng-Tsong Chen
  - et al.
- 2010
- Proceedings of SPIE - The International Society for Optical Engineering 2010
Integration compatible porous SiCOH dielectrics from 45 to 22 nm
- - S. Gates
  - A. Grill
  - et al.
- 2008
- ADMETA 2008
The effect of material and process interactions on BEOL integration
- - T. Spooner
  - J.C. Arnold
  - et al.
- 2009
- ECS Meeting 2009
BEOL integration of highly damage -resistant porous ultra low-k material using direct CMP and via-first process
- - T. Iijima
  - Q. Lin
  - et al.
- 2006
- IITC 2006
Electromigration Cu mass flow in Cu interconnections
- - C.-K. Hu
  - D. Canaperi
  - et al.
- 2006
- Thin Solid Films
Time dependent dielectric breakdown in a low-k interlevel dielectric
- - J.R. Lloyd
  - E. Liniger
  - et al.
- 2004
- Microelectronics Reliability
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- - C.-K. Hu
  - D. Canaperi
  - et al.
- 2004
- IRPS 2004
Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing
- - T. Dalton
  - N. Fuller
  - et al.
- 2004
- IITC 2004
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- - C.-K. Hu
  - D. Canaperi
  - et al.
- 2004
- IRPS 2004
Porous ILD process development for sub 100nm integration
- - K. Malone
  - S.T. Chen
  - et al.
- 2003
- ADMETA 2003