Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering
- K.L. Saenger
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
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97 results for Stephen Rossnagel
Sputter deposition for semiconductor manufacturing
- S.M. Rossnagel
- 1999
- IBM J. Res. Dev
Extendibility of Cu damascene to 0.1 μm wide interconnections
- C.-K. Hu
- K.Y. Lee
- et al.
- 1998
- MRS Spring Meeting 1998
Directional copper deposition using dc magnetron self-sputtering
- Zbigniew J. Radzimski
- Witold M. Posadowski
- et al.
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching
- Y. Hsu
- T. Standaert
- et al.
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Interaction between gas rarefaction and metal ionization in ionized physical vapor deposition
- S.M. Rossnagel
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Directional and ionized physical vapor deposition for microelectronics applications
- S.M. Rossnagel
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Numerical simulation of etching and deposition processes
- Satoshi Hamaguchi
- Anita A. Mayo
- et al.
- 1997
- Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Across-wafer nonuniformity of long throw sputter deposition
- A. Mayo
- S. Hamaguchi
- et al.
- 1997
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Ionized magnetron sputtering for lining and filling trenches and vias
- S.M. Rossnagel
- 1996
- Semiconductor International