Technology viable DC performance elements for Si/SiGe channel CMOS FinFTT
- G. Tsutsui
- Ruqiang Bao
- et al.
- 2016
- IEDM 2016
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4 results for Hoon Kim
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- Takeshi Nogami
- C. Penny
- et al.
- 2012
- IEDM 2012
Mechanism of co liner as enhancement layer for Cu interconnect gap-fill
- M. He
- X. Zhang
- et al.
- 2013
- JES
Diffusion barrier properties of very thin TaN with high nitrogen concentration
- S.M. Rossnagel
- H. Kim
- 2003
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures