Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
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3 results for Scott Lefevre
Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures
- John M. Papalia
- Devi Koty
- et al.
- 2022
- SPIE Advanced Lithography 2022
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017