Formation of Al-Cu via/interconnect by low-pressure collimated sputtering
- R.V. Joshi
- H.M. Dalal
- et al.
- 1995
- Applied Physics Letters
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Electromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- H.S. Rathore
- R. Filippi
- et al.
- 1992
- SPIE Microelectronic Processing 1992