Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers
- A. Domenicucci
- R. Filippi
- et al.
- 1996
- Journal of Applied Physics
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
32 results for Ronald Filippi
Formation of Al-Cu via/interconnect by low-pressure collimated sputtering
- R.V. Joshi
- H.M. Dalal
- et al.
- 1995
- Applied Physics Letters