Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers
- A. Domenicucci
- R. Filippi
- et al.
- 1996
- Journal of Applied Physics
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Formation of Al-Cu via/interconnect by low-pressure collimated sputtering
- R.V. Joshi
- H.M. Dalal
- et al.
- 1995
- Applied Physics Letters