Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020
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Material and process improvements towards sub 36nm pitch EUV single exposure
- Karen Petrillo
- Dave Hetzer
- et al.
- 2019
- ANTS 2019