High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- Takeshi Nogami
- Tibor Bolom
- et al.
- 2010
- IEDM 2010
Publications
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8 results for Mary Ann Zaitz
Nanoporous materials integration into advanced microprocessors
- E. Todd Ryan
- Cathy Labelle
- et al.
- 2005
- MRS Spring Meeting 2005
Effects of wafer cleaning reduction on metals removal and ultrathin gate oxide quality
- C. D'Emic
- S. Cohen
- et al.
- 1997
- MRS Spring Meeting 1997
Leveraging sub-E0 dose assessment methodology to improve EUV lithography cluster dose performance
- Chris Robinson
- Cody Murray
- et al.
- 2020
- SPIE Advanced Lithography 2020
Hybrid clean approach for post-copper CMP defect reduction
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- ASMC 2013
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
CVD Co and its application to Cu damascene interconnections
- Takeshi Nogami
- J. Maniscalco
- et al.
- 2010
- IITC 2010
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf