Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

6 results for Uwe Zschenderlein

All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- - Jonas Zürcher
  - Luca Del Carro
  - et al.
- 2016
- ECTC 2016
Embedded power insert enabling dual-side cooling of microprocessors
- - Thomas Brunschwiler
  - Dominic Gschwend
  - et al.
- 2015
- ECTC 2015
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- - Thomas Brunschwiler
  - Jonas Zürcher
  - et al.
- 2016
- ITherm 2016
Re-building the Underfill: Performance of percolating fillers at package scale
- - Uwe Zschenderlein
  - Mario Baum
  - et al.
- 2016
- EuroSimE 2016
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- - Sridhar Kumar
  - Uwe Zschenderlein
  - et al.
- 2015
- EuroSimE 2015
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- - Thomas Brunschwiler
  - Jonas Zürcher
  - et al.
- 2016
- ASME Journal of Electronic Packaging