Novel Low Cost Bumping Process with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Takashi Hisada
- et al.
- 2016
- ECTC 2016
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This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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1 result for Yasuharu Yamada