Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
Publications
Date
Featured collections
Popular topics
29 results for Jeffrey Gelorme
Introducing biobased materials into the electronics industry: Developing a lignin-based resin for printed wiring boards
- Laura L. Kosbar
- Jeffrey D. Gelorme
- et al.
- 2000
- Journal of Industrial Ecology
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Ultrasonic and dip resist development processes for 50 nm device fabrication
- K.L. Lee
- J. Bucchignano
- et al.
- 1997
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Negative photoresists for optical lithography
- J.M. Shaw
- J. Gelorme
- et al.
- 1997
- IBM J. Res. Dev
Bio-based resins for the manufacture of printed wiring boards
- L.L. Kosbar
- J. Gelorme
- 1996
- Journal of Engineering and Applied Science
Future packaging materials: Cost performance, and environmental issues
- J.M. Shaw
- Stephen L. Buchwalter
- et al.
- 1996
- American Chemical Society, Polymer Preprints, Division of Polymer Chemistry
Micromachining applications of a high resolution ultrathick photoresist
- K.Y. Lee
- N. LaBianca
- et al.
- 1995
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Comparison of vapor and liquid phase silylation processes of photoresists
- E. Babich
- J. Paraszczak
- et al.
- 1991
- Microelectronic Engineering