Improved electromigration lifetime for copper interconnects using tantalum implant
- Jeff Gambino
- Timothy D. Sullivan
- et al.
- 2007
- MRS Spring Meeting 2007
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7 results for J. Burnham
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2016
- IITC/AMC 2016
Advanced metal and dielectric barrier cap films for Cu low k interconnects
- Deepika Priyadarshini
- Son Nguyen
- et al.
- 2014
- IITC/AMC 2014
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k Interconnects
- Son Van Nguyen
- Deepika Priyadarshini
- et al.
- 2014
- ECS Meeting 2014
Reliability of Cu interconnects with Ta implant
- J.P. Gambino
- T.D. Sullivan
- et al.
- 2007
- IITC 2007
Growth of crystalline defects on the surface of FSG dielectrics
- J.P. Gambino
- J. Burnham
- et al.
- 2003
- AMC 2003
The combined effects of deuterium anneals and deuterated barrier-nitride processing on hot-electron degradation in MOSFET's
- Thomas G. Ference
- Jay S. Burnham
- et al.
- 1999
- IEEE Transactions on Electron Devices