Publications

2 results for Kaushik Kumar

Plasma etch patterning of EUV lithography: Balancing roughness and selectivity trade off
- - Sebastian U. Engelmann
  - Qinghuang Lin
  - et al.
- 2016
- SPIE Advanced Lithography 2016
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
- - Yannick Feurprier
  - Katie Lutker-Lee
  - et al.
- 2015
- SPIE Advanced Lithography 2015