Evolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Mikhail Treger
- et al.
- 2016
- IEEE T-DMR
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4 results for Mikhail Treger
Prediction of recrystallization times in electroplated copper thin films
- Mikhail Treger
- C. Witt
- et al.
- 2016
- Thin Solid Films
Characterization of room temperature recrystallization kinetics in electroplated copper thin films with concurrent x-ray diffraction and electrical resistivity measurements
- Mikhail Treger
- Christian Witt
- et al.
- 2013
- Journal of Applied Physics
Evolution of strain energy during recrystallization of plated Cu films
- Conal E. Murray
- Robert Rosenberg
- et al.
- 2013
- Journal of Applied Physics