Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Publications
Date
Featured collections
Popular topics
4 results for Dominic Gschwend
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
- Thomas Brunschwiler
- Timo Tick
- et al.
- 2014
- ESTC 2014
Laminate with thermal - Power insert for efficient front-side heat removal and power delivery
- Dominic Gschwend
- Timo Tick
- et al.
- 2014
- CIPS 2014
Steady-state low thermal resistance characterization apparatus: The bulk thermal tester
- Brian R. Burg
- Manuel Kolly
- et al.
- 2015
- Review of Scientific Instruments