Electrical and reliability evaluation of Cu/Low-k integration: Exploration of PVD barrier/seed and CVD SiC(N,H) cap depositions
- C.-C. Yang
- D. Edelstein
- et al.
- 2004
- ADMETA 2004
Publications
Date
Featured collections
Popular topics
41 results for F. Chen
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Novel techniques for scaling deep trench DRAM capacitor technology to 0.11 μm and beyond
- P.S. Parkinson
- K. Settlemyer
- et al.
- 2003
- VLSI-TSA 2003
Time-dependent dielectric breakdown evaluation of deep trench capacitor with sidewall hemispherical, polysilicon grains for gigabit DRAM technology
- Fen Chen
- Porshia Parkinson
- et al.
- 2002
- IIRW 2002
Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges
- F. Chen
- Carole Graas
- et al.
- 2015
- Microelectronics Reliability
Invasion percolation model for abnormal time-dependent dielectric breakdown characteristic of low-k dielectrics due to massive metallic diffusion
- Fen Chen
- Michael Shinosky
- et al.
- 2012
- Applied Physics Letters
Co capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2012
- Microelectronic Engineering