Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges
- F. Chen
- Carole Graas
- et al.
- 2015
- Microelectronics Reliability
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3 results for Carole Graas
Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015
A method for rapid screening of various low-k TDDB models
- F. Chen
- Carole Graas
- et al.
- 2015
- IRPS 2015