A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
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17 results for Glenn Biery
Integration of copper and fluorosilicate glass for 0.18 μm interconnections
- E. Barth
- T. Ivers
- et al.
- 2000
- IITC 2000
0.18 μm high-performance logic technology
- S.W. Crowder
- S. Greco
- et al.
- 1999
- VLSI Technology 1999
High-performance sub-0.25 μm CMOS technology with multiple thresholds and copper interconnects
- L. Su
- R. Schulz
- et al.
- 1998
- VLSI Technology 1998
Application of E-beam hot spot inspection for early detection of systematic patterning problems to a FinFET technology
- Deborah A. Ryan
- Oliver D. Patterson
- et al.
- 2015
- J. Micro/Nanolithogr. MEMS MOEMS
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
1/f noise and electromigration in aluminum films: The role of film microstructure and texture
- R.G. Smith
- G. Biery
- et al.
- 1994
- Applied Physics Letters