Comparison of electromigration in Cu interconnects with ALD or PVD TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- ECS Meeting 2006
Publications
Date
Featured collections
Popular topics
144 results for Lynne Gignac
Three-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomography
- P.A. Ercius
- D.A. Muller
- et al.
- 2006
- M&M 2006
Imaging at high beam energies in the scanning electron microscope
- L. Gignac
- S.H. Boettcher
- et al.
- 2006
- M&M 2006
Three-dimensional imaging of nanovoids in copper interconnects using incoherent bright field tomography
- Peter Ercius
- Matthew Weyland
- et al.
- 2006
- Applied Physics Letters
Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films
Damascene copper integration impact on electomigration and stress migration
- Anthony K. Stamper
- H. Baks
- et al.
- 2005
- AMC 2005
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
- Sung K. Kang
- Donovan Leonard
- et al.
- 2006
- Journal of Electronic Materials
Electromigration of Cu/low dielectric constant interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- Microelectronics Reliability
Effect of metal liner on electromigration in Cu Damascene lines
- C.-K. Hu
- L. Gignac
- et al.
- 2005
- Journal of Applied Physics
Systematic study of workfunction engineering and scavenging effect using NiSi alloy FUSI metal gates with advanced gate stacks
- Y.-H. Kim
- C. Cabral Jr.
- et al.
- 2005
- IEDM 2005