Development and commercialization of solder bump fabrication technology with molten solder injection method
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
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Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014