Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)Yannick FeurprierKatie Lutker-Leeet al.2015SPIE Advanced Lithography 2015
Towards production ready processing with a state-of-the-art EUV clusterKaren PetrilloNicole Saulnieret al.2015SPIE Advanced Lithography 2015