Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
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5 results for Aakrati Jain
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023
Thermal Performance Characterization of Stacked Silicon Microcoolers for Spatially Non-Uniform Power Dissipation
- Aakrati Jain
- Dishit Parekh
- et al.
- 2021
- ITherm 2021
Analytical Solution for a Chip Temperature Distribution in a Multilayer Chip-Package with Thermal Warpage
- Aakrati Jain
- Dishit Parekh
- et al.
- 2021
- ITherm 2021