Reliable Chiplet integration on high density laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Pouliot-Grenier
- et al.
- 2024
- ECTC 2024
Publications
Date
Featured collections
Popular topics
4 results for Sathya Raghavan
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
The impact of Al on contact resistance and its suitability in fine pitch interconnects
- Fee Li Lie
- Sathya Raghavan
- et al.
- 2023
- IMAPS 2023