Reliable Chiplet integration on high density laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Pouliot-Grenier
- et al.
- 2024
- ECTC 2024
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4 results for Hiroyuki Mori
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
Thermal and Mechanical Analysis of Embedded Liquid Cooling with Microchannel and Pin-fin Structures
- Risa Miyazawa
- Hiroyuki Mori
- et al.
- 2024
- ITherm 2024