Reliable Chiplet integration on high density laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Pouliot-Grenier
- et al.
- 2024
- ECTC 2024
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4 results for Divya Taneja
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- Divya Taneja
- Katherine Pilger
- et al.
- 2024
- DPC 2024